Patent Assignment
Reel/Frame 074019/0640
Merger and Change of Name
Recorded: 2025-12-22
Pages: 42
Assignee
FM HOLDINGS CO., LTD.
18TH FLOOR, TORANOMON HILLS STATION TOWER, 6-1, TORANOMON 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties
(23)
Circuit Board with a Plurality of Laminated Insulating Layers Having Conductive Paste Filled Vias and Manufacturing Method Thereof
Application:
17/924,273 →
Publication:
US 2023/0180398
Method for Manufacturing Circuit Board
Circuit Board, Method for Manufacturing Circuit Board, and Electronic Device
Application:
18/271,754 →
Publication:
US 2024/0064907
Multilayer Board
Application:
18/288,418 →
Publication:
US 2024/0147613
Multilayer Substrate, Method for Manufacturing Multilayer Substrate, and Electronic Device
Application:
18/845,641 →
Publication:
US 2025/0194009
Circuit Board, Method for Manufacturing Circuit Board, and Electronic Device
Application:
18/712,124 →
Laminated Substrate and Method of Manufacturing Laminated Substrate
Application:
19/187,108 →
Method for Manufacturing Multilayer Substrate
Application:
19/215,982 →
Process for Producing Multilayer Board
Buildup Board, and Electronic Component and Apparatus Having the Buildup Board
Method of Making Printed Wiring Board and Method of Making Printed Circuit Board Unit
Laminated Circuit Board and Board Producing Method
Production Method of Circuit Board
Circuit Board, Production Method of Circuit Board, and Electronic Equipment
Wiring Substrate and Manufacturing Method of Wiring Substrate
Wiring Board, Electronic Device, and Wiring Board Manufacturing Method
Method of Manufacturing Substrate and Substrate
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
Method of Manufacturing Board
Multilayer Substrate
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
Waveguide Member and Waveguide Layered Product
Substrate, Method for Manufacturing Substrate, and Electronic Device
Related Assignments
(23)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 4, 2007
From: NAKAGAWA, TAKASHI; SUGANO, SEIICHI; IIDA, KENJI; MAEHARA, YASUTOMO
To: FUJITSU LIMITED
Reel/Frame 018776/0407 →
Assignment of Assignor's Interest
Sep 6, 2007
From: SAITOU, AKIYOSHI; MIDORIKAWA, TAKESHI; KURAISHI, TORU; KUMAGAI, CHIKAYUKI
To: FUJITSU LIMITED
Reel/Frame 019791/0131 →
Assignment of Assignor's Interest
Feb 13, 2009
From: YOSHIMURA, HIDEAKI; NAKAGAWA, TAKASHI; FUKUZONO, KENJI; KANDA, TAKASHI
To: FUJITSU LIMITED
Reel/Frame 022255/0625 →
Assignment of Assignor's Interest
Mar 29, 2011
From: YOSHIMURA, HIDEAKI; HONDO, ASAMI
To: FUJITSU LIMITED
Reel/Frame 026042/0766 →
Assignment of Assignor's Interest
Jun 10, 2014
From: IIDA, KENJI; NAKAGAWA, TAKASHI; YAMAWAKI, SEIGO; KARAHASHI, YASUHIRO
To: FUJITSU LIMITED
Reel/Frame 033064/0043 →
Assignment of Assignor's Interest
Oct 3, 2016
From: FUKUI, KEI; ARAI, KAZUYA; KOMEMURA, KOJI; IIJIMA, KAZUHIKO
To: FUJITSU LIMITED; SONY CORPORATION
Reel/Frame 039925/0450 →
Assignment of Assignor's Interest
Nov 17, 2017
From: OZAKI, NORIKAZU; MIYAO, HIROSHI; HASEGAWA, SATORU
To: FUJITSU LIMITED
Reel/Frame 044163/0693 →
Assignment of Assignor's Interest
Apr 19, 2018
From: FUKUI, KEI; HOSHIKAWA, YOUICHI; KOBAYASHI, HIROMITSU; FUJISAKI, HIDEHIKO
To: FUJITSU LIMITED
Reel/Frame 045584/0106 →
Assignment of Assignor's Interest
Sep 7, 2018
From: IWAI, TOSHIKI; MIZUTANI, DAISUKE
To: FUJITSU LIMITED
Reel/Frame 047031/0407 →
Assignment of Assignor's Interest
Jun 4, 2019
From: IWAI, TOSHIKI; MIZUTANI, DAISUKE; SAKUYAMA, SEIKI; SAKAI, TAIJI
To: FUJITSU LIMITED
Reel/Frame 049362/0572 →
Assignment of Assignor's Interest
Oct 24, 2019
From: IWAI, TOSHIKI; SAKAI, TAIJI
To: FUJITSU LIMITED
Reel/Frame 050816/0251 →
Assignment of Assignor's Interest
Apr 8, 2020
From: FUJITSU LIMITED
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 052345/0895 →
Assignment of Assignor's Interest
Apr 8, 2020
From: FUJITSU LIMITED
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 052345/0603 →
Assignment of Assignor's Interest
Nov 9, 2022
From: IIDA, KENJI; OZAKI, NORIKAZU; SAKAI, TAIJI; NAKAGAWA, TAKASHI
To: FICT LIMITED
Reel/Frame 061711/0063 →
Change of Name
Jun 6, 2023
From: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
To: FICT LIMITED
Reel/Frame 063881/0638 →
Assignment of Assignor's Interest
Jul 11, 2023
From: SAKAI, TAIJI; IIDA, KENJI; OZAKI, NORIKAZU; TAKANO, KENJI
To: FICT LIMITED
Reel/Frame 064213/0757 →
Assignment of Assignor's Interest
Oct 6, 2023
From: IIDA, KENJI; OZAKI, NORIKAZU; SAKAI, TAIJI; NAKAGAWA, TAKASHI
To: FICT LIMITED
Reel/Frame 065146/0389 →
Assignment of Assignor's Interest
Oct 26, 2023
From: NAKAGAWA, TAKASHI; OZAKI, NORIKAZU; SAKAI, TAIJI; TAKANO, KENJI
To: FICT LIMITED
Reel/Frame 065356/0193 →
Assignment of Assignor's Interest
May 21, 2024
From: IIDA, KENJI; OZAKI, NORIKAZU; SAKAI, TAIJI
To: FICT LIMITED
Reel/Frame 067481/0896 →
Assignment of Assignor's Interest
Sep 10, 2024
From: IIDA, KENJI; SAKAI, TAIJI; INABA, TAKAYUKI; NAKAGAWA, TAKASHI
To: FICT LIMITED
Reel/Frame 068544/0353 →
Assignment of Assignor's Interest
Apr 23, 2025
From: OZAKI, NORIKAZU; MIYAGAWA, TETSUROU; NAKAGAWA, TAKASHI; SAKAI, NAOKI
To: FICT LIMITED
Reel/Frame 071385/0865 →
Assignment of Assignor's Interest
May 22, 2025
From: OZAKI, NORIKAZU; MIYAGAWA, TETSUROU; NAKAGAWA, TAKASHI; SAKAI, NAOKI
To: FICT LIMITED
Reel/Frame 071200/0121 →
Change of Name
Apr 23, 2026
From: FM HOLDINGS CO., LTD.
To: FICT LIMITED
Reel/Frame 075466/0044 →