Process for producing multilayer board
A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.
1. A process for producing a multilayer board including a first substrate having a terminal which is coated with a protective plating film formed of a gold plating film on an underlying nickel film, a second substrate having a terminal which is coated with a protective plating film formed of a gold plating film on an underlying nickel film, an insulating layer, and a conductive member, the first substrate being bonded to the second substrate with the insulating layer provided therebetween, the terminals being opposite each other and being electrically connected with the conductive member, the process comprising:
applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of copper particles each of which is plated with tin-bismuth solder, the copper particles each having a first melting point, and the tin-bismuth solder having a second melting point lower than the first melting point;
preparing a bonding sheet on which a through hole has been formed;
bonding the bonding sheet to the second substrate in such a manner that the terminal of the second substrate is located in the through hole, the through hole of the bonding sheet having a greater width than the terminal of the second substrate;
positioning the first substrate and the second substrate in such a manner that the terminals thereof are opposite each other and laminating the first substrate and the second substrate with the bonding sheet provided therebetween; and
heating and pressuring the resulting laminate to effect curing of the bonding sheet and the bonding ink to form an integral structure, whereby gold in the protective plating films diffuses and nickel in the underlying nickel films is alloyed with the filler to form strong bonding.
2. The process for producing a multilayer board according to claim 1 , wherein the first substrate is a motherboard, and the second substrate has a size smaller than that of the motherboard and is at least one mounting board.
3. The process for producing a multilayer board according to claim 1 , wherein the second substrate is a motherboard, and the first substrate has a size smaller than that of the motherboard and is at least one mounting board.
4. The process for producing a multilayer board according to claim 1 , wherein the bonding sheet has release sheets bonded to the front surface and the back surface of the bonding sheet.