IP Library Assignment 063881/0638
Patent Assignment
Reel/Frame 063881/0638

Change of Name

Recorded: 2023-06-06 Pages: 21
Assignor
Assignee
FICT LIMITED
36, OAZA KITAOWARIBE, NAGANO-SHI, NAGANO, 381-8501, JAPAN
Covered Properties (19)
Process for Producing Multilayer Board
Patent: 7,943,001 →
Application: 11/649,203 →
Publication: US 2007/0289706
Buildup Board, and Electronic Component and Apparatus Having the Buildup Board
Patent: 8,304,662 →
Application: 11/806,680 →
Publication: US 2007/0295533
Method of Producing Substrate
Patent: 8,151,456 →
Application: 12/175,732 →
Publication: US 2009/0094825
Method of Making Printed Wiring Board and Method of Making Printed Circuit Board Unit
Patent: 8,152,953 →
Application: 12/365,279 →
Publication: US 2009/0294056
Core Substrate and Printed Wiring Board
Patent: 8,119,925 →
Application: 12/390,010 →
Publication: US 2009/0294161
Laminated Circuit Board and Board Producing Method
Patent: 8,669,481 →
Application: 13/074,442 →
Publication: US 2011/0303453
Laminated Circuit Board and Board Producing Method
Patent: 8,586,876 →
Application: 13/085,804 →
Publication: US 2011/0303454
Production Method of Circuit Board
Patent: 9,769,936 →
Application: 14/300,360 →
Publication: US 2015/0029679
Wiring Substrate and Manufacturing Method of Wiring Substrate
Application: 15/278,798 →
Publication: US 2017/0103944
Circuit Board, Production Method of Circuit Board, and Electronic Equipment
Application: 15/677,771 →
Publication: US 2017/0347465
Method of Manufacturing Substrate and Substrate
Application: 15/806,385 →
Publication: US 2018/0160547
Method of Manufacturing Board
Application: 15/956,829 →
Publication: US 2018/0315687
Wiring Board, Electronic Device, and Wiring Board Manufacturing Method
Application: 16/124,730 →
Publication: US 2019/0013266
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
Application: 16/162,470 →
Publication: US 2019/0053385
Circuit Board, Method of Manufacturing Circuit Board, and Electronic Device
Application: 16/430,735 →
Publication: US 2019/0289715
Multilayer Substrate
Application: 16/662,440 →
Publication: US 2020/0152562
Waveguide Member and Waveguide Layered Product
Application: 17/424,284 →
Publication: US 2022/0066098
Circuit Board, Method for Manufacturing Circuit Board, and Electronic Device
Application: 17/634,115 →
Publication: US 2022/0322534
Substrate, Method for Manufacturing Substrate, and Electronic Device
Application: 17/635,756 →
Publication: US 2022/0312595
Related Assignments (20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 4, 2007
From: NAKAGAWA, TAKASHI; SUGANO, SEIICHI; IIDA, KENJI; MAEHARA, YASUTOMO
To: FUJITSU LIMITED
Reel/Frame 018776/0407 →
Assignment of Assignor's Interest Sep 6, 2007
From: SAITOU, AKIYOSHI; MIDORIKAWA, TAKESHI; KURAISHI, TORU; KUMAGAI, CHIKAYUKI
To: FUJITSU LIMITED
Reel/Frame 019791/0131 →
Assignment of Assignor's Interest Jul 31, 2008
From: MAEHARA, YASUTOMO; IIDA, KENJI; ABE, TOMOYUKI; HIRANO, SHIN
To: FUJITSU LIMITED
Reel/Frame 021345/0598 →
Assignment of Assignor's Interest Feb 13, 2009
From: YOSHIMURA, HIDEAKI; NAKAGAWA, TAKASHI; FUKUZONO, KENJI; KANDA, TAKASHI
To: FUJITSU LIMITED
Reel/Frame 022255/0625 →
Assignment of Assignor's Interest Feb 24, 2009
From: YOSHIMURA, HIDEAKI; IIDA, KENJI; ABE, TOMOYUKI; MAEHARA, YASUTOMO
To: FUJITSU LIMITED
Reel/Frame 022298/0766 →
Assignment of Assignor's Interest Mar 29, 2011
From: YOSHIMURA, HIDEAKI; HONDO, ASAMI
To: FUJITSU LIMITED
Reel/Frame 026042/0766 →
Assignment of Assignor's Interest Apr 13, 2011
From: YOSHIMURA, HIDEAKI
To: FUJITSU LIMITED
Reel/Frame 026121/0544 →
Assignment of Assignor's Interest Jun 10, 2014
From: IIDA, KENJI; NAKAGAWA, TAKASHI; YAMAWAKI, SEIGO; KARAHASHI, YASUHIRO
To: FUJITSU LIMITED
Reel/Frame 033064/0043 →
Assignment of Assignor's Interest Oct 3, 2016
From: FUKUI, KEI; ARAI, KAZUYA; KOMEMURA, KOJI; IIJIMA, KAZUHIKO
To: FUJITSU LIMITED; SONY CORPORATION
Reel/Frame 039925/0450 →
Assignment of Assignor's Interest Nov 17, 2017
From: OZAKI, NORIKAZU; MIYAO, HIROSHI; HASEGAWA, SATORU
To: FUJITSU LIMITED
Reel/Frame 044163/0693 →
Assignment of Assignor's Interest Apr 19, 2018
From: FUKUI, KEI; HOSHIKAWA, YOUICHI; KOBAYASHI, HIROMITSU; FUJISAKI, HIDEHIKO
To: FUJITSU LIMITED
Reel/Frame 045584/0106 →
Assignment of Assignor's Interest Sep 7, 2018
From: IWAI, TOSHIKI; MIZUTANI, DAISUKE
To: FUJITSU LIMITED
Reel/Frame 047031/0407 →
Assignment of Assignor's Interest Oct 17, 2018
From: FURUYAMA, MASAHARU; MIZUTANI, DAISUKE; AKAHOSHI, TOMOYUKI; KOIDE, MASATERU
To: FUJITSU LIMITED
Reel/Frame 047689/0820 →
Assignment of Assignor's Interest Jun 4, 2019
From: IWAI, TOSHIKI; MIZUTANI, DAISUKE; SAKUYAMA, SEIKI; SAKAI, TAIJI
To: FUJITSU LIMITED
Reel/Frame 049362/0572 →
Assignment of Assignor's Interest Oct 24, 2019
From: IWAI, TOSHIKI; SAKAI, TAIJI
To: FUJITSU LIMITED
Reel/Frame 050816/0251 →
Assignment of Assignor's Interest Apr 8, 2020
From: FUJITSU LIMITED
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 052345/0895 →
Assignment of Assignor's Interest Apr 8, 2020
From: FUJITSU LIMITED
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 052345/0603 →
Assignment of Assignor's Interest Jul 20, 2021
From: IWAI, TOSHIKI; SAKAI, TAIJI
To: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
Reel/Frame 056915/0139 →
Merger and Change of Name Dec 22, 2025
From: FICT LIMITED; FM HOLDINGS CO., LTD.
To: FM HOLDINGS CO., LTD.
Reel/Frame 074019/0640 →
Change of Name Apr 23, 2026
From: FM HOLDINGS CO., LTD.
To: FICT LIMITED
Reel/Frame 075466/0044 →