Laminated circuit board and board producing method
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole through which the first land is connected to the second land, wherein a diameter of the through-hole of the plate is larger than a diameter of a component that is made by filling the conducting material.
1. A laminated circuit board comprising:
a first wiring board that has a first land formed on a surface thereof;
a second wiring board that has a second land formed on a surface thereof;
a bonding layer that is laid between the first wiring board and the second wiring board and electrically connects the first land and the second land via a conducting material and that has a first through-hole filled with the conducting material; and
a plate that has a second through-hole through which the first land is connected to the second land, wherein
a diameter of the second through-hole of the plate is larger than a diameter of the first through-hole of the bonding layer and is smaller than a diameter of each of the first and second lands.
2. The laminated circuit board according to claim 1 , wherein
a volume of the second through-hole is larger than an excess part of the conducting material that is obtained when the first land is connected to the second land, the excess part being a part of the conducting material filling with the first through-hole and flowing onto the bonding layer when the laminated circuit board does not comprise the plate that has the second through-hole.
3. The laminated circuit board according to claim 1 , wherein
the diameter of the second through-hole of the plate is 1.5 times larger than the diameter of the first through-hole of the bonding layer.