IP Library Assignment 052345/0895
Patent Assignment
Reel/Frame 052345/0895

Assignment of Assignor's Interest

Recorded: 2020-04-08 Pages: 2
Assignor
FUJITSU LIMITED
Executed: 2020-03-27
Assignee
FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
36, OAZA KITAOWARIBE, NAGANO-SHI, NAGANO, 381-8501, JAPAN
Covered Property (1)
Wiring Substrate and Manufacturing Method of Wiring Substrate
Application: 15/278,798 →
Publication: US 2017/0103944
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 3, 2016
From: FUKUI, KEI; ARAI, KAZUYA; KOMEMURA, KOJI; IIJIMA, KAZUHIKO
To: FUJITSU LIMITED; SONY CORPORATION
Reel/Frame 039925/0450 →
Change of Name Jun 6, 2023
From: FUJITSU INTERCONNECT TECHNOLOGIES LIMITED
To: FICT LIMITED
Reel/Frame 063881/0638 →
Merger and Change of Name Dec 22, 2025
From: FICT LIMITED; FM HOLDINGS CO., LTD.
To: FM HOLDINGS CO., LTD.
Reel/Frame 074019/0640 →
Change of Name Apr 23, 2026
From: FM HOLDINGS CO., LTD.
To: FICT LIMITED
Reel/Frame 075466/0044 →