Core substrate and printed wiring board
The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.
1. A core substrate comprising:
a core layer including an electrically-conductive layer made of carbon fibers impregnated with resin and core insulating layers overlaid on front and back surfaces of the electrically-conductive layer, the core insulating layers made of glass fibers impregnated with resin;
a through hole formed in the core layer, the through hole penetrating through the core layer from a front surface of the core layer to a back surface of the core layer;
a cylindrical filling material filling the through hole;
a pair of overlying insulating layers made of glass fibers impregnated with resin, the overlying insulating layers being overlaid on the front and back surfaces of the core layer, respectively, so that the core layer and the cylindrical filling material are sandwiched between the overlying insulating layers;
a through bore formed in and penetrating through at least one of the overlying insulating layers along a longitudinal axis of the through hole; and
an electrically-conductive via formed in a shape of a cylinder along an inward wall surface of the through bore.
2. The core substrate according to claim 1 , wherein the overlying insulating layers cover over the filling material.
3. The core substrate according to claim 1 , wherein the glass fibers form a woven cloth or a nonwoven cloth.
4. A printed wiring board comprising:
a core layer including an electrically-conductive layer made of carbon fibers impregnated with resin and core insulating layers overlaid on front and back surfaces of the electrically-conductive layer, the core insulating layers made of glass fibers impregnated with resin;
a through hole formed in the core layer, the through hole penetrating through the core layer from a front surface of the core layer to a back surface of the core layer;
a cylindrical filling material filling the through hole;
a pair of overlying insulating layers made of glass fibers impregnated with resin, the overlying insulating layers being overlaid on the front and back surfaces of the core layer, respectively, so that the core layer and the cylindrical filling material are sandwiched between the overlying insulating layers;
a through bore formed in and penetrating through at least one of the overlying insulating layers along a longitudinal axis of the through hole; and
an electrically-conductive via formed in a shape of a cylinder along an inward wall surface of the through bore.
5. The printed wiring board according to claim 4 , wherein the overlying insulating layers cover over the filling material.
6. The printed wiring board according to claim 4 , wherein the glass fibers form a woven cloth or a nonwoven cloth.
7. The printed wiring board according to claim 4 , further comprising a build-up layer overlaid on at least one of the overlying insulating layers.