Laminated circuit board and board producing method
A laminated circuit board includes a first wiring board that has a first land formed on a surface thereof; a second wiring board that has a second land formed on a surface thereof; a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; and a plate that has a through-hole into which the conducting material is supplied, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking.
1. A laminated circuit board comprising:
a first wiring board that has a first land formed on a surface thereof;
a second wiring board that has a second land formed on a surface thereof;
a bonding layer that is made of a bonding resin, being laid between the first wiring board and the second wiring board, wherein the bonding layer electrically connects the first land and the second land via a conducting material; and
a plate that has a through-hole into which the conducting material is supplied, wherein
the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking, the resin accommodating space having a total volume equal to a volume calculated using a residual copper ratios of wiring surfaces of the first and the second wiring boards.
2. The laminated circuit board according to claim 1 , wherein the resin accommodating space is a through-hole.
3. The laminated circuit board according to claim 1 , wherein the bonding layer is formed on each of the front surface and the rear surface of the plate in advance.
4. The laminated circuit board according to claim 2 , wherein the bonding layer is formed on each of the front surface and the rear surface of the plate in advance.
5. The laminated circuit board according to claim 3 , wherein a bonding surface of the bonding layer that is formed on each of the front surface and the rear surface of the plate is covered with a protective film.
6. The laminated circuit board according to claim 3 , wherein a bonding layer that is formed on either the front surface or the rear surface of the plate has a through-hole that accommodates therein the excess bonding resin but the other bonding layer does not.
7. The laminated circuit board according to claim 4 , wherein a bonding layer that is formed on either the front surface or the rear surface of the plate has a through-hole that accommodates therein the excess bonding resin but the other bonding layer does not.
8. The laminated circuit board according to claim 1 , wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.
9. The laminated circuit board according to claim 2 , wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.
10. The laminated circuit board according to claim 3 , wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.
11. The laminated circuit board according to claim 4 , wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.
12. The laminated circuit board according to claim 5 , wherein the through-hole of the plate is filled with the conducting material in advance to connect the first land and the second land.
13. A method of producing a laminated circuit board, the method comprising:
forming bonding layers on bonding surfaces of a first wiring board and a second wiring board, wherein the first wiring board has a first land formed on the surface thereof, the second wiring board has a second land formed on the surface thereof, and the bonding layers electrically connect the first land and the second land via a conducting material;
forming a through-hole on the bonding layers to accommodate the conducting material;
filling the through-hole with the conducting material;
aligning a plate to a bonding plane where the first wiring board and the second wiring board are bonded together, wherein the plate has a resin accommodating space that accommodates therein an excess bonding resin that appears during layer stacking, the resin accommodating space having a total volume equal to a volume calculated using a residual copper ratios of wiring surfaces of the first and the second wiring boards; and
applying heat under pressure to perform the layer stacking, wherein the pressure is in a direction perpendicular to the plate position-decided at the deciding and layers of the first wiring board and the second wiring board.