Patent Assignment
Reel/Frame 068544/0353
Assignment of Assignor's Interest
Recorded: 2024-09-10
Pages: 4
Assignors
IIDA, KENJI
Executed: 2024-04-09
SAKAI, TAIJI
Executed: 2024-04-09
INABA, TAKAYUKI
Executed: 2024-04-09
NAKAGAWA, TAKASHI
Executed: 2024-04-09
Assignee
FICT LIMITED
36, OAZA KITAOWARIBE, NAGANO-SHI, NAGANO, 381-8501, JAPAN
Covered Property
(1)
Multilayer Substrate, Method for Manufacturing Multilayer Substrate, and Electronic Device
Application:
18/845,641 →
Publication:
US 2025/0194009
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.