Method for manufacturing circuit board
The present invention addresses the problem of providing a circuit board for which the manufacturing process is short and which has a laminate surface having uniform flatness. As a solution to the problem, this method for manufacturing a circuit board includes: manufacturing a three-layer metal ( 58 ) having, on one surface thereof, a first metal layer ( 26 ) formed in a pattern shape; manufacturing unit structures ( 60 ) each having the first metal layer ( 26 ), a cured first insulating base material ( 22 ) filled with a cured first conductive paste ( 32 ), a second metal layer ( 28 ), and a semi-cured second insulating base material ( 24 ) filled with a semi-cured second conductive paste ( 36 ); joining together the first insulating base material ( 22 ) in one unit structure ( 60 ) among a plurality of the unit structures with the second insulating base material ( 24 ) in another unit structure ( 60 ); and layering the plurality of unit structures ( 60 ).
1 . A method for manufacturing a circuit board, comprising:
a process of manufacturing a first metal layer being formed into a pattern shape by disposing, on a surface of a first metal foil that is opposite to a surface on which a first insulating base material is to be laminated, a third metal layer containing a metal that is different from the first metal foil and a fourth metal layer in succession and etching the first metal foil from a direction in which the first insulating base material is laminated;
a process of removing a portion of the third metal layer by etching from the direction in which the first insulating base material is laminated;
a process of manufacturing a cured first insulating base material in which the first metal layer being formed into a pattern shape is disposed at a first surface, a second metal layer being formed into a pattern shape is disposed at a second surface, and a first through hole that is formed between the first metal layer and the second metal layer is filled with a first conductive paste that connects the first metal layer and the second metal layer;
a process of removing the entire fourth metal layer by etching;
a process of removing the entire third metal layer by etching;
a process of manufacturing a unit component including the first insulating base material and a semi-cured second insulating base material that is disposed on a side of the first insulating base material corresponding to the second surface and in which a second through hole communicating with the second metal layer is filled with a second conductive paste connected to the second metal layer; and
a process of laminating a plurality of unit components by joining to one another the first insulating base material of one of the plurality of the unit components and the second insulating base material of another unit component of the plurality of the unit components.
2 . The method for manufacturing the circuit board according to claim 1 further comprising:
a process of performing surface roughening on a surface of the first metal layer on which the first insulating base material is to be laminated and a surface of the fourth metal layer on which the first insulating base material is to be laminated such that an arithmetic average roughness (Ra) of the surface of the first metal layer and the surface of the fourth metal layer is 1.0 μm to 2.0 μm; and
a process of performing surface roughening on a surface of the first metal layer on which the second insulating base material is to be laminated and a surface of the second metal layer on which the second insulating base material is to be laminated such that an arithmetic average roughness (Ra) of the surface of the first metal layer and the surface of the second metal layer is 1.0 μm to 2.0 μm.
3 . The method for manufacturing the circuit board according to claim 1 , wherein first metal layer is formed into a trapezoidal shape in which a diameter decreases from a side corresponding to the first surface of the first insulating base material toward a side corresponding to the second surface, and
the second metal layer is formed into a trapezoidal shape in which a diameter decreases from a side corresponding to the first surface of the second insulating base material toward a side corresponding to the second surface.
4 . The method for manufacturing the circuit board according to claim 1 , wherein the first metal layer of the unit component is embedded in the first insulating base material, and the second metal layer of the unit component is embedded in the second insulating base material in the process of manufacturing the unit component.