Patent Assignment
Reel/Frame 061715/0866
Assignment of Assignor's Interest
Recorded: 2022-11-10
Pages: 6
Assignors
OWAKI, HIROFUMI
Executed: 2022-06-28
AGAWA, TOMONORI
Executed: 2022-06-28
TOGANO, KUNIHIKO
Executed: 2022-06-28
SUZUKI, HIROO
Executed: 2022-07-15
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 243-0014, JAPAN
Covered Property
(1)
Sensor Module