Sensor module
A sensor module according to an embodiment of the present technology includes a housing, a sensor board, an external connector, a flexible printed circuit, and a metallic shield case. The flexible printed circuit electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line. The shield case includes a bottom portion that is arranged between the flexible printed circuit and the external connector. The external connector includes a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case. The bottom portion includes a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.
1. A sensor module, comprising:
a housing;
a sensor board that includes a sensor element and is arranged in the housing;
an external connector that is provided to the housing;
a flexible printed circuit that electrically connects the sensor board and the external connector, the flexible printed circuit including a signal line and a ground line; and
a metallic shield case that includes a bottom portion and a peripheral surface portion, the bottom portion being arranged between the flexible printed circuit and the external connector, the peripheral surface portion covering around the sensor board,
the external connector including a first connection pin that is connected to the signal line, a second connection pin that is connected to the ground line, and a third connection pin that is connected to the bottom portion of the shield case,
the bottom portion including a first hole, a second hole, a third hole, and a thermal storage, the first hole being a hole through which the first connection pin passes, the second hole being a hole through which the second connection pin passes, the third hole being a hole through which the third connection pin passes, the thermal storage being provided around the third hole and covered with a solder material used to join the third connection pin to the bottom portion.
2. The sensor module according to claim 1 , wherein
the flexible printed circuit further includes a base-material end that supports the signal line and the ground line and is arranged in the bottom portion,
the base-material end includes an opening through which the third connection pin passes, the opening having a larger opening area than the third hole, and
the thermal storage is provided to a region that faces the opening.
3. The sensor module according to claim 2 , wherein
the thermal storage includes a plurality of slits annularly formed around the third hole.
4. The sensor module according to claim 2 , wherein
the thermal storage includes a concave portion that is annularly formed around the third hole.
5. The sensor module according to claim 2 , wherein
the thermal storage includes a heat transfer portion that is more highly thermally conductive than a metallic material of the bottom portion.
6. The sensor module according to claim 2 , wherein
the third connection pin is arranged offset from a center of the opening.
7. The sensor module according to claim 2 , wherein
the opening is formed into a circular shape or an elliptic shape.
8. The sensor module according to claim 1 , wherein
the third connection pin includes a plurality of connection pins, and
the opening includes a plurality of openings respectively provided correspondingly to connection pins of the plurality of connection pins.
9. The sensor module according to claim 8 , wherein
the connection pins of the plurality of connection pins are provided symmetrically with respect to the first connection pin.
10. The sensor module according to claim 1 , wherein
the sensor element is a solid-state imaging device.
11. The sensor module according to claim 1 , wherein
the sensor module is attachable to a vehicle.