Patent Assignment
Reel/Frame 061721/0791
Assignment of Assignor's Interest
Recorded: 2022-11-10
Pages: 3
Assignors
HSIEH, SHENG-LIN
Executed: 2019-09-11
CHEN, I-CHIH
Executed: 2019-09-11
HSIEH, CHING-PEI
Executed: 2019-09-11
CHEN, KUAN JUNG
Executed: 2019-09-11
Assignees
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSING RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
TSMC NANJING COMPANY, LIMITED
16 ZIFENG ROAD, PUKOU ECONOMIC DEVELOPMENT ZONE, JIANGSU PROVINCE, NANJING, CHINA
Covered Property
(1)
Trench Etching Process for Photoresist Line Roughness Improvement