Assignment of Assignor's Interest

Recorded: 2022-10-20 Pages: 6

Assignors

KARHADE, OMKAR

Executed: 2022-09-29

SHAKYA, JAGAT

Executed: 2022-10-02

KILAMBI, HARINI

Executed: 2022-09-29

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Integrated Circuit Packages with Hybrid Bonded Dies and Methods of Manufacturing the Same

Application: 17/957,926 →

Publication: US 2024/0113088

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.