Patent Assignment
Reel/Frame 062277/0966
Assignment of Assignor's Interest
Recorded: 2023-01-04
Pages: 4
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Integrated Circuit Packages with Hybrid Bonded Dies and Methods of Manufacturing the Same
Application:
17/957,926 →
Publication:
US 2024/0113088
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.