Patent Assignment
Reel/Frame 061769/0084
Assignment of Assignor's Interest
Recorded: 2022-11-15
Pages: 4
Assignors
KOMINE, MAYUMI
Executed: 2022-10-26
YAMASHITA, TAKASHI
Executed: 2022-10-26
MINAMI, HISATAKA
Executed: 2022-11-02
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Cmp Polishing Liquid and Polishing Method
Application:
17/925,175 →
Publication:
US 2023/0174822
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.