IP Library Assignment 061770/0144
Patent Assignment
Reel/Frame 061770/0144

Change of Name

Recorded: 2022-10-25 Pages: 52
Assignor
HITACHI CHEMICAL CO., LTD.
Executed: 2020-10-01
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property (1)
Polishing Liquid, Polishing Liquid Set, and Polishing Method
Application: 16/981,560 →
Publication: US 2021/0017422
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 16, 2020
From: IWANO, TOMOHIRO
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 053792/0243 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →