Patent Assignment
Reel/Frame 061807/0263
Assignment of Assignor's Interest
Recorded: 2022-11-17
Pages: 5
Assignors
CHOU, HSI-TSENG
Executed: 2021-10-18
CHIU, CHIH-WEI
Executed: 2021-10-18
LIN, ZHAO-HE
Executed: 2021-10-18
LIU, JAKE WALDVOGEL
Executed: 2021-10-18
Assignee
OHMPLUS TECHNOLOGY INC.
22F.-7, NO. 99, SEC. 1, XINTAI 5TH RD., XIZHI DIST., NEW TAIPEI CITY, 221416, TAIWAN
Covered Property
(1)
System for Testing Antenna-in-Package Modules and Method for Using the Same