Patent Assignment
Reel/Frame 061811/0799
Assignment of Assignor's Interest
Recorded: 2022-11-17
Pages: 6
Assignors
CHI, HEEJO
Executed: 2022-11-17
IM, SEUNGWON
Executed: 2022-11-17
JEON, OSEOB
Executed: 2022-11-17
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Power Module Package with Molded via and Dual Side Press-Fit Pin
Application:
18/056,442 →
Publication:
US 2024/0170378
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Feb 24, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 062882/0265 →
Release of Security Interest in Patents Previously Recorded at Reel 062882, Frame 0265
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0423 →