Patent Assignment
Reel/Frame 061817/0571
Assignment of Assignor's Interest
Recorded: 2022-11-17
Pages: 8
Assignors
VERMA, PURAKH RAJ
Executed: 2022-11-15
WEN, CHING-YANG
Executed: 2022-11-15
CHEN, XINGXING
Executed: 2022-11-15
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Package Structure