Patent Assignment
Reel/Frame 061906/0736
Assignment of Assignor's Interest
Recorded: 2022-11-29
Pages: 5
Assignee
MITSUBISHI MATERIALS CORPORATION
2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN
Covered Property
(1)
Insulating Resin Circuit Substrate