Patent Assignment
Reel/Frame 061913/0900
Assignment of Assignor's Interest
Recorded: 2022-11-29
Pages: 2
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Method for Manufacturing Electronic Component, Resin Composition for Temporary Protection, and Resin Film for Temporary Protection
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.