Patent Assignment
Reel/Frame 061993/0594
Assignment of Assignor's Interest
Recorded: 2022-12-06
Pages: 6
Assignors
CHO, SOHYE
Executed: 2022-11-17
MOON, KWANGJIN
Executed: 2022-11-19
LEE, HOJIN
Executed: 2022-11-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Having a Through-via Structure Electrically Connected to a Contact Structure