Patent Assignment
Reel/Frame 061995/0987
Assignment of Assignor's Interest
Recorded: 2022-12-06
Pages: 5
Assignors
DAI, MIN-KUN
Executed: 2022-01-26
HUANG, YEN-CHIEH
Executed: 2022-01-26
CHIANG, KUO-CHANG
Executed: 2022-01-26
TSAI, HAN-TING
Executed: 2022-01-27
LIN, TSANN
Executed: 2022-06-26
LIN, CHUNG-TE
Executed: 2022-01-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Method of Forming the Same