Patent Assignment
Reel/Frame 062049/0655
Assignment of Assignor's Interest
Recorded: 2022-12-12
Pages: 8
Assignors
CHEN, SHENG-CHAU
Executed: 2018-07-24
HSIAO, CHENG-TAI
Executed: 2018-07-24
TSAI, CHENG-YUAN
Executed: 2018-07-24
KUANG, HSUN-CHUNG
Executed: 2018-07-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Conductive Structure Connection With Interconnect Structure