Patent Assignment
Reel/Frame 062092/0042
Assignment of Assignor's Interest
Recorded: 2022-12-14
Pages: 6
Assignee
LIPAC CO., LTD.
#916, 10, SEONYU-RO 9-GIL, YEONGDEUNGPO-GU, SEOUL, 07281, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Manufacturing Semiconductor Package
Application:
18/010,378 →
Publication:
US 2023/0268331