Patent Assignment
Reel/Frame 062099/0758
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 4
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same
Application:
17/981,535 →
Publication:
US 2023/0223350