Patent Assignment
Reel/Frame 062106/0071
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 5
Assignors
KOMORI, NAOMITSU
Executed: 2022-08-30
NOMOTO, SHUJI
Executed: 2022-08-26
NAKAMURA, AKIHIRO
Executed: 2022-08-30
SAWAMOTO, HAYATO
Executed: 2022-08-30
Assignee
SHOWA DENKO MATERIALS CO., LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Photosensitive Resin Composition, Dry Film, Printed Wiring Board, and Method for Producing Printed Wiring Board
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.