Patent Assignment
Reel/Frame 062109/0395
Assignment of Assignor's Interest
Recorded: 2022-12-15
Pages: 8
Assignors
HUANG, YU-LIEN
Executed: 2020-10-05
FU, CHING-FENG
Executed: 2020-10-05
WANG, GUAN-REN
Executed: 2020-10-05
HSU, CHE-MING
Executed: 2020-10-05
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Structures for Semiconductor Devices and Methods of Manufacturing the Same