Patent Assignment
Reel/Frame 062139/0108
Assignment of Assignor's Interest
Recorded: 2022-12-19
Pages: 4
Assignors
WANG, SHENG-CHEN
Executed: 2020-12-20
YANG, FENG-CHENG
Executed: 2020-12-15
LIN, MENG-HAN
Executed: 2020-12-15
CHIA, HAN-JONG
Executed: 2020-12-15
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Novel 3D Ram Sl/Bl Contact Modulation