Patent Assignment
Reel/Frame 062143/0881
Assignment of Assignor's Interest
Recorded: 2022-12-19
Pages: 4
Assignors
XIAO, YOU-CHENG
Executed: 2020-08-25
HU, JHIH-SIANG
Executed: 2020-08-26
WANG, RU-YU
Executed: 2020-08-25
CHEN, JUNG-HSUAN
Executed: 2020-08-26
CHIANG, TING-WEI
Executed: 2020-08-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device with Increased Unit Density