IP Library Assignment 062161/0167
Patent Assignment
Reel/Frame 062161/0167

Assignment of Assignor's Interest

Recorded: 2022-12-20 Pages: 10
Assignors
ROMBACH, PIRMIN
Executed: 2021-05-19
RASMUSSEN, KURT
Executed: 2021-05-19
MORTENSEN, DENNIS
Executed: 2021-05-19
LIU, CHENG-YEN
Executed: 2021-05-19
GINNERUP, MORTEN
Executed: 2021-05-25
RAVNKILDE, JAN
Executed: 2021-05-19
AKIYAMA, JOTARO
Executed: 2021-05-26
Assignee
TDK ELECTRONICS AG
ROSENHEIMERSTRASSE 116B, MÜNCHEN, 81669, GERMANY
Covered Property (1)
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Application: 18/068,908 →
Publication: US 2023/0118429
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 5, 2024
From: AKIYAMA, JOTARO
To: TDK CORPORATION
Reel/Frame 067635/0188 →
Assignment of Assignor's Interest Jan 6, 2025
From: TDK ELECTRONICS AG
To: TDK CORPORATION
Reel/Frame 069759/0858 →
Assignment of Assignor's Interest Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →