Patent Assignment
Reel/Frame 069759/0858
Assignment of Assignor's Interest
Recorded: 2025-01-06
Pages: 4
Assignor
TDK ELECTRONICS AG
Executed: 2024-11-29
Assignee
TDK CORPORATION
2-5-1, NIHONBASHI, CHUO-KU, TOKYO, 103-6128, JAPAN
Covered Property
(1)
Microelectromechanical Microphone with Membrane Trench Reinforcements and Method of Fabrication
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 20, 2022
From: ROMBACH, PIRMIN; RASMUSSEN, KURT; MORTENSEN, DENNIS; LIU, CHENG-YEN
To: TDK ELECTRONICS AG
Reel/Frame 062161/0167 →
Assignment of Assignor's Interest
Jun 5, 2024
From: AKIYAMA, JOTARO
To: TDK CORPORATION
Reel/Frame 067635/0188 →
Assignment of Assignor's Interest
Oct 13, 2025
From: TDK CORPORATION
To: INVENSENSE, INC.
Reel/Frame 073080/0824 →