Patent Assignment
Reel/Frame 062169/0757
Assignment of Assignor's Interest
Recorded: 2022-12-19
Pages: 4
Assignors
GAO, GUILIAN
Executed: 2018-11-05
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2018-11-05
MIRKARIMI, LAURA WILLS
Executed: 2018-12-12
KATKAR, RAJESH
Executed: 2018-11-05
MOHAMMED, ILYAS
Executed: 2018-11-09
UZOH, CYPRIAN EMEKA
Executed: 2018-11-06
Assignee
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Layer Structures for Making Direct Metal-to-Metal Bonds at Low Temperatures in Microelectronics and Method for Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 21, 2022
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 062202/0318 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →