Patent Assignment
Reel/Frame 062202/0318
Change of Name
Recorded: 2022-12-21
Pages: 4
Assignor
INVENSAS BONDING TECHNOLOGIES, INC.
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Layer Structures for Making Direct Metal-to-Metal Bonds at Low Temperatures in Microelectronics and Method for Forming the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 19, 2022
From: GAO, GUILIAN; FOUNTAIN, GAIUS GILLMAN, JR.; MIRKARIMI, LAURA WILLS; KATKAR, RAJESH
To: INVENSAS BONDING TECHNOLOGIES, INC.
Reel/Frame 062169/0757 →
Security Interest
May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →