Patent Assignment
Reel/Frame 062170/0380
Assignment of Assignor's Interest
Recorded: 2022-12-19
Pages: 6
Assignors
KIM, HYUNJOON
Executed: 2022-11-04
HONG, SEOGWOO
Executed: 2022-11-14
KIM, DONGKYUN
Executed: 2022-11-14
KIM, DONGHO
Executed: 2022-11-14
PARK, JOONYONG
Executed: 2022-11-09
SONG, SANGHOON
Executed: 2022-11-09
HWANG, KYUNGWOOK
Executed: 2022-11-09
HWANG, JUNSIK
Executed: 2022-11-09
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Transfer Method of Aligning, Placing, and Bonding Micro Semiconductor Chips on Substrate
Application:
18/084,186 →
Publication:
US 2024/0006563