Patent Assignment
Reel/Frame 062234/0904
Assignment of Assignor's Interest
Recorded: 2022-12-29
Pages: 3
Assignors
LEE, CHAI CHEE
Executed: 2022-09-14
GABRILLO, MARIE HAZEL BAROZZO
Executed: 2022-09-13
MOHAMED, NOR HAQIMI
Executed: 2022-09-19
LIM, WEE AUN JASON
Executed: 2022-09-14
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Molded Package Having an Electrically Conductive Clip with a Convex Curved Surface Attached to a Semiconductor Die