IP Library › Assignment 062251/0686
Patent Assignment
Reel/Frame 062251/0686

Assignment of Assignor's Interest

Recorded: 2023-01-02 Pages: 4
Assignors
WU, JUNG-TANG
Executed: 2018-12-18
HO, JUI-HUNG
Executed: 2018-12-17
LEE, CHIN-SZU
Executed: 2018-12-17
YU, WU MENG
Executed: 2018-12-17
WU, SZU-HUA
Executed: 2018-12-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Diffusion Barrier Layer on Interconnection Vias for Magnetic Tunnel Junctions
Application: 18/148,829 →
Publication: US 2023/0137291
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Fourth Inventor Name Previously Recorded at Reel: 062251 Frame: 0686. Assignor(S) Hereby Confirms the Assignment. Mar 16, 2023
From: WU, JUNG-TANG; HO, JUI-HUNG; LEE, CHIN-SZU; WU, MENG-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 063102/0758 →