Patent Assignment
Reel/Frame 062253/0827
Assignment of Assignor's Interest
Recorded: 2023-01-02
Pages: 4
Assignors
PAN, ZHIGANG
Executed: 2022-12-13
WANG, NING
Executed: 2022-12-13
SUN, XIAOQIN
Executed: 2022-12-13
SUN, PENG
Executed: 2022-12-13
YANG, DAOHONG
Executed: 2022-12-13
HU, SHENG
Executed: 2022-12-16
YE, GUOLIANG
Executed: 2022-12-13
Assignee
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.18 GAOXIN 4TH ROAD, DONGHU DEVELOPMENT ZONE, WUHAN, HUBEI, 430205, CHINA
Covered Property
(1)
Chip Packaging Method and Chip Packaging Structure
Application:
18/149,077 →
Publication:
US 2024/0105532