Patent Assignment
Reel/Frame 062258/0596
Assignment of Assignor's Interest
Recorded: 2023-01-03
Pages: 5
Assignors
CHENG, CHIH HSUAN
Executed: 2018-06-05
LIAO, CHIH-TENG
Executed: 2018-06-05
CHEN, CHIH-SHAN
Executed: 2018-06-05
CHIU, YI-WEI
Executed: 2018-06-05
WENG, TZU-CHAN
Executed: 2018-06-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Source and Drain Structure with Reduced Contact Resistance and Enhanced Mobility