Patent Assignment
Reel/Frame 062272/0937
Assignment of Assignor's Interest
Recorded: 2023-01-04
Pages: 4
Assignors
YU, LI-ZHEN
Executed: 2022-09-01
SU, HUAN-CHIEH
Executed: 2022-09-01
HUANG, LIN-YU
Executed: 2022-09-01
WANG, CHIH-HAO
Executed: 2022-09-01
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices Including Through Vias and Methods of Forming the Same