Patent Assignment
Reel/Frame 062277/0258
Assignment of Assignor's Interest
Recorded: 2023-01-04
Pages: 3
Assignors
KAO, MIN-FENG
Executed: 2022-12-12
YAUNG, DUN-NIAN
Executed: 2022-12-12
LIN, HSING-CHIH
Executed: 2022-12-09
LIU, JEN-CHENG
Executed: 2022-12-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, TAIWAN
Covered Property
(1)
Semiconductor Structure and Forming Method Thereof