Patent Assignment
Reel/Frame 062277/0712
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 4
Assignee
AUO CORPORATION
NO. 1, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Property
(1)
Method of Manufacturing a Device Substrate