Patent Assignment
Reel/Frame 062286/0627
Assignment of Assignor's Interest
Recorded: 2023-01-05
Pages: 6
Assignors
SHIN, YONGMOO
Executed: 2022-12-15
KIM, SINJAE
Executed: 2022-12-15
KOO, KYOWANG
Executed: 2022-12-15
PARK, HYUNSEOK
Executed: 2022-12-16
Assignee
STATS CHIPPAC PTE. LTD.
5 YISHUN STREET 23, SINGAPORE, 768442, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming RDL with Graphene-Coated Core