Patent Assignment
Reel/Frame 062313/0987
Assignment of Assignor's Interest
Recorded: 2023-01-09
Pages: 4
Assignors
CHIU, CHAO-WEI
Executed: 2022-11-29
YU, JEN-JUI
Executed: 2022-11-28
KUO, HSUAN-TING
Executed: 2022-11-28
WONG, CHENG-SHIUAN
Executed: 2023-01-08
LIN, HSIU-JEN
Executed: 2022-11-28
HSIEH, CHING-HUA
Executed: 2022-11-28
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Devices and Methods of Forming the Same