IP Library › Assignment 062324/0471
Patent Assignment
Reel/Frame 062324/0471

Assignment of Assignor's Interest

Recorded: 2023-01-10 Pages: 7
Assignors
LAN, JE-HSIUNG
Executed: 2023-01-01
KIM, JONGHAE
Executed: 2023-01-01
DUTTA, RANADEEP
Executed: 2023-01-01
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Through Molding Contact Enabled Emi Shielding
Application: 18/067,565 →
Publication: US 2024/0203895