Patent Assignment
Reel/Frame 062331/0568
Assignment of Assignor's Interest
Recorded: 2023-01-10
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Packages and Methods of Forming the Same
Application:
18/152,453 →
Publication:
US 2024/0234400