Patent Assignment
Reel/Frame 062335/0049
Assignment of Assignor's Interest
Recorded: 2023-01-11
Pages: 7
Assignors
NOGUCHI, YUICHIRO
Executed: 2022-12-22
DZHANGIROV, ALEXANDER
Executed: 2022-12-23
SEYAMA, KOHEI
Executed: 2022-12-22
Assignee
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI,, TOKYO, 208-8585, JAPAN
Covered Property
(1)
Mounting Device Comprising Semiconductor Chip Mounted Through Thermo-Compression Tool and Mounting Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.