Patent Assignment
Reel/Frame 072769/0218
Merger
Recorded: 2025-11-04
Pages: 17
Assignor
SHINKAWA LTD.
Executed: 2025-07-01
Assignee
YAMAHA ROBOTICS CO., LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, JAPAN
Covered Property
(1)
Mounting Device Comprising Semiconductor Chip Mounted Through Thermo-Compression Tool and Mounting Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.