IP Library › Assignment 062352/0207
Patent Assignment
Reel/Frame 062352/0207

Corrective Assignment to Correct the Typographical Error in the Application Number Previously Recorded at Reel: 062312 Frame: 0420. Assignor(S) Hereby Confirms the Assignment.

Recorded: 2023-01-11 Pages: 7
Assignors
HUANG, YU-YI
Executed: 2022-09-18
LIN, YU-HUNG
Executed: 2022-09-17
WANG, WEI-MING
Executed: 2022-09-18
CHEN, CHEN
Executed: 2022-09-18
TAI, SHIH-PENG
Executed: 2022-09-18
YEE, KUO-CHUNG
Executed: 2022-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property (1)
Adding Sealing Material to Wafer edge for Wafer Bonding
Application: 18/151,663 →
Publication: US 2024/0096830
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 9, 2023
From: HUANG, YU-YI; LIN, YU-HUNG; WANG, WEI-MING; CHEN, CHEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 062312/0420 →