IP Library › Assignment 062312/0420
Patent Assignment
Reel/Frame 062312/0420

Assignment of Assignor's Interest

Recorded: 2023-01-09 Pages: 4
Assignors
HUANG, YU-YI
Executed: 2022-09-18
LIN, YU-HUNG
Executed: 2022-09-17
WANG, WEI-MING
Executed: 2022-09-18
CHEN, CHEN
Executed: 2022-09-18
TAI, SHIH-PENG
Executed: 2022-09-18
YEE, KUO-CHUNG
Executed: 2022-09-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties (2)
V-Shaped Sige Recess Volume Trim for Improved Device Performance and Layout Dependence
Patent: 9,735,252 →
Application: 15/151,663 →
Publication: US 2016/0254366
Adding Sealing Material to Wafer edge for Wafer Bonding
Application: 18/151,663 →
Publication: US 2024/0096830
Related Assignments (2)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2016
From: CHEN, CHAO-HSUING; WANG, LING-SUNG; LIN, CHI-YEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 038545/0402 →
Corrective Assignment to Correct the Typographical Error in the Application Number Previously Recorded at Reel: 062312 Frame: 0420. Assignor(S) Hereby Confirms the Assignment. Jan 11, 2023
From: HUANG, YU-YI; LIN, YU-HUNG; WANG, WEI-MING; CHEN, CHEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 062352/0207 →